EPC2014 is available now! LYNTEAM Technology is the stocking distributor for EPC2014, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for EPC2014 by email, we will give you a best price according your plan.
Buy EPC2014 with LYNTEAM, save your money and time.
Our email: [email protected]
EPC2014
- Part Number:
- EPC2014
- Manufacturer:
- EPC
- Description:
- TRANS GAN 40V 10A BUMPED DIE
- Lead Free Status:
- Lead free / RoHS Compliant
- Stock Quantity:
- 25899 Pieces
- Delivery Time:
- 1-2 days
- Lead time:
- 4-8 weeks
- Data sheet:
- EPC2014.pdf
Introduction
Specifications
| Condition | New & Original, tested |
|---|---|
| Country of origin | Contact us |
| Marking Code | Send by email |
| Vgs(th) (Max) @ Id: | 2.5V @ 2mA |
| Vgs (Max): | +6V, -5V |
| Technology: | GaNFET (Gallium Nitride) |
| Supplier Device Package: | Die Outline (5-Solder Bar) |
| Series: | eGaN® |
| Rds On (Max) @ Id, Vgs: | 16 mOhm @ 5A, 5V |
| Power Dissipation (Max): | - |
| Packaging: | Cut Tape (CT) |
| Package / Case: | Die |
| Other Names: | 917-1018-1 |
| Operating Temperature: | -40°C ~ 150°C (TJ) |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Input Capacitance (Ciss) (Max) @ Vds: | 325pF @ 20V |
| Gate Charge (Qg) (Max) @ Vgs: | 2.8nC @ 5V |
| FET Type: | N-Channel |
| FET Feature: | - |
| Drive Voltage (Max Rds On, Min Rds On): | 5V |
| Drain to Source Voltage (Vdss): | 40V |
| Detailed Description: | N-Channel 40V 10A (Ta) Surface Mount Die Outline (5-Solder Bar) |
| Current - Continuous Drain (Id) @ 25°C: | 10A (Ta) |
| Email: | [email protected] |
Related parts for EPC2014
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
EPC2012CENGR | EPC | TRANS GAN 200V 5A BUMPED DIE | Inquiry |
 |
EPC2019ENG | EPC | TRANS GAN 200V 8.5A BUMPED DIE | Inquiry |
 |
EPC2015C | EPC | TRANS GAN 40V 33A BUMPED DIE | Inquiry |
 |
EPC2018 | EPC | TRANS GAN 150V 12A BUMPED DIE | Inquiry |
 |
EPC2016 | EPC | TRANS GAN 100V 11A BUMPED DIE | Inquiry |
 |
EPC2016C | EPC | TRANS GAN 100V 18A BUMPED DIE | Inquiry |
|
EPC2001C | EPC | TRANS GAN 100V 36A BUMPED DIE | Inquiry |
|
EPC2001 | EPC | TRANS GAN 100V 25A BUMPED DIE | Inquiry |
 |
EPC2015CENGR | EPC | TRANS GAN 40V 36A BUMPED DIE | Inquiry |
 |
EPC2010CENGR | EPC | TRANS GAN 200V 22A BUMPED DIE | Inquiry |
 |
EPC2007 | EPC | TRANS GAN 100V 6A BUMPED DIE | Inquiry |
 |
EPC2012C | EPC | TRANS GAN 200V 5A BUMPED DIE | Inquiry |
|
EPC2007C | EPC | TRANS GAN 100V 6A BUMPED DIE | Inquiry |
 |
EPC2020 | EPC | TRANS GAN 60V 90A BUMPED DIE | Inquiry |
|
EPC2010C | EPC | TRANS GAN 200V 22A BUMPED DIE | Inquiry |
|
EPC2014C | EPC | TRANS GAN 40V 10A BUMPED DIE | Inquiry |
|
EPC2010 | EPC | TRANS GAN 200V 12A BUMPED DIE | Inquiry |
|
EPC2012 | EPC | TRANS GAN 200V 3A BUMPED DIE | Inquiry |
|
EPC2015 | EPC | TRANS GAN 40V 33A BUMPED DIE | Inquiry |
 |
EPC2019 | EPC | TRANS GAN 200V 8.5A BUMPED DIE | Inquiry |
Latest News
- Moels Micro Electronics has set up a new offices in Taiwan, China to expand business territory
- The performance of Texas instruments is still to be boosted, and the two storage factories push new flash memory products
- The first quarter financial report of the SEF semiconductor (ST) decreases, and the demand for automobiles has slowed down
- The performance of Texas instruments is still to be boosted, and the two storage factories push new flash memory products
- Local mature chip volume, Samsung NAND flash memory production capacity near load
- Vishay launches miniled packaging high brightness small blue and pure green LED
- Ansonmei launched an inductive position sensor for the industrial and transportation market
- Ruisa starts the old factory to increase the power device, the earthquake affects DRAM output mild
- Microchip enables the production capacity of TSMC and increases price increases
- Ruisa launched the new RA0 series ultra -low power entry -level MCU
- Melexis launches a full -integrated inductor switch chip
- X-FAB introduces image sensor back illumination technology to enhance CMOS sensor performance