EPC2012C
EPC2012C
Part Number:
EPC2012C
Manufacturer:
EPC
Description:
TRANS GAN 200V 5A BUMPED DIE
Lead Free Status:
Lead free / RoHS Compliant
Stock Quantity:
32629 Pieces
Delivery Time:
1-2 days
Lead time:
4-8 weeks
Data sheet:
EPC2012C.pdf

Introduction

EPC2012C is available now! LYNTEAM Technology is the stocking distributor for EPC2012C, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for EPC2012C by email, we will give you a best price according your plan.
Buy EPC2012C with LYNTEAM, save your money and time.
Our email: [email protected]

Specifications

Condition New & Original, tested
Country of origin Contact us
Marking Code Send by email
Vgs(th) (Max) @ Id:2.5V @ 1mA
Vgs (Max):+6V, -4V
Technology:GaNFET (Gallium Nitride)
Supplier Device Package:Die Outline (4-Solder Bar)
Series:eGaN®
Rds On (Max) @ Id, Vgs:100 mOhm @ 3A, 5V
Power Dissipation (Max):-
Packaging:Tape & Reel (TR)
Package / Case:Die
Other Names:917-1084-2
Operating Temperature:-40°C ~ 150°C (TJ)
Mounting Type:Surface Mount
Moisture Sensitivity Level (MSL):1 (Unlimited)
Manufacturer Standard Lead Time:12 Weeks
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Input Capacitance (Ciss) (Max) @ Vds:140pF @ 100V
Gate Charge (Qg) (Max) @ Vgs:1.3nC @ 5V
FET Type:N-Channel
FET Feature:-
Drive Voltage (Max Rds On, Min Rds On):5V
Drain to Source Voltage (Vdss):200V
Detailed Description:N-Channel 200V 5A (Ta) Surface Mount Die Outline (4-Solder Bar)
Current - Continuous Drain (Id) @ 25°C:5A (Ta)
Email:[email protected]

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