1. The power accumulation is pushed and transformed, and the driver IC will exit the driver IC andsensorfield

According to the Science and Technology Board Daily, Huang Chongren, chairman of the Lane Ferry Factory Liqi, said that 2024 is the year of operation transformation, and it will gradually exit the panel drive IC andsensorfield.

Li Ji DianstorageTechnology is the first one that can make CPU logicchipCompanies with memory chip stack, stack technology will not lose toTSMCEssenceIn addition, Xie Jieju, general manager of Lijician, revealed that the needs of the storage foundry and mature process logic founder after the holiday are urgent.

2.RisaPlanning to set up a joint venture in IndiaSealfactory

RisaThe news was announced on March 1st that two companies, CG Power and Industrial Solutions and Stars Micro Electronics, set up a joint venture in India, build and operate a post -segment in the post -stageSealfactory.On February 29, the federal cabinet, hosted by Indian Prime Minister MoodysemiconductorPlanned joint venture projects.

The joint venture will hold 92.3%of the shares by CG, andRisaAnd Stars Microelectronics hold about 6.8%and 0.9%of the equity, respectively.The joint venture plans to invest 760 billion rupees within five years.joint ventureSealFactoryhees will be established in Sanno in Gujilatzon, and the production capacity will be increased to 15 million dailychipEssenceThe factory's products will cover traditional packaging such as QFN and QFP to advanced packaging such as FC BGA and FC CSP, facingcar, Consumption, industry,5GWaiting for industries.

3.Sia: Global this yearsemiconductorSales increased by 15.2% year -on -year

In the United StatessemiconductorThe latest data released by the Industry Association (SIA), the total sales volume of the global semiconductor industry in January 2024 was 47.6 billion U.S. dollars, an increase of 15.2%compared with US $ 41.3 billion in January 2023, but 48.7 billion in December 2021 in December 2021 The US dollar decreased by 2.1%.

Source: SIA

John Neuffer, president and CEO of SIA, said that global sales have increased year -on -year, the largest increase since May 2022. It is expected that the market will continue to grow this year, and the annual sales in 2024 will increase double -digit than in 2023.

In terms of region, sales of China (26.6%), the Americas (20.3%) and the Asia-Pacific region/all other regions (12.8%) increased year-on-year, but the sales of Japan (-6.4%) and Europe (-1.4%) decreased decreased. EssenceThe sales of all markets have declined from month-on-month sales: Asia-Pacific/all other markets (-1.4%), American market (-1.5%), Chinese market (-2.5%), European market (-2.8%), and the Japanese market (- 3.9%).

4. 4..NvidiaNew AIchipOccupyTSMC3/4 nano -production

According to the Taiwan Industrial and Commercial Times of China,NvidiaThe GTC Conference will appear on the 17th local time. The market is estimated that H200 and B100 will release their share in advance. These twochipWill be used separatelyTSMCThe 4 -nanometer and 3 -nanometer process will be available in the second quarter, and the B100 has passed the orders with the Chiclet design architecture.The legal person pointed out that TSMC's 3/4 nanometer capacity was almost full, and the off -season operation in the first quarter was not fading.

TSMCThe advanced process has also continued to be full. In February, the capacity utilization rate continued to exceed 90 %, and the demand for AI continued.The supply chain said that AI, HPC, etc. can be produced by a wafer of the waferchipFor a quarter of consumer products, production is more difficult; TSMC can reach stable mass production, which is very important for chip industry.

5.OLED DDI bargaining pressure increased dramatic

According to the CICE Daily Daily quoted the Taiwan Electronic Times, China, it shows the driverchip(DDI) Industry insiders bluntly stated that in the past, this time has been regarded as the main momentum of revenue profit growthOLED DDI products have also begun to face more and more price pressure pressure, especiallycell phoneOLED DDI's bargaining pressure is more significant.

6. The original Korean factory will continue the absolute advantage of HBM memory share

According to the Science and Technology Board Daily, Morgan Chase (Xiao Mo) recently releasedstorageMarket report, indicated inGloryAnnounce the beginning of large -scale production for useNvidiaAfter H200's high -bandwidth memory (HBM), the competition pattern of HBM3E is increasing.

Morgan Chase predicts,SamsungElectronicsSK HylosThe HBM3E timetable is roughly consistent with expectations, and it is estimated that the current HBM market size has no substantial changes.JPMorgan Chase is expected to continue to lead in the HBM market. In 2024, the market share is 48%of SK Hynix and Samsung 44%. In 2025, it further evolved into SK Hynix 47%and Samsung's 45%market share.