The storage accounts for about 1/4 of the scale of the entire integrated circuit market, which plays an important role in the development of the social digital economy.

The storage market is led by DRAM and NAND Flash. The three giants have an absolute leading advantage.

Depending on whether it is necessary to power on to maintain data, memory can be divided into easy loss storage (RAM) and non -volatile storage (ROM).Among them, the common dynamic random access memory (DRAM) is commonly used with the CPU to provide the storage of intermediate data when the CPU is used for CPU. At present, the market accounts for about 56%. There are flashes (NAND FLASH), etc., which are mainly used for large -volume data storage. The power -off data is not lost. At present, the market accounts for about 40%.

Specifically, DRAM can be divided into DDR, LPDDR, GDDR, and traditional (Legacy/SDR) DRAM. Among them, DDR and LPDDR accounted for about 90%, which is the most widely used segmentation product in DRAM.From the application point of view, LPDDR is mainly used in embedded storage in consumer electronics products such as smartphones, tablets, etc. DDR is mainly used in server, personal computers and other fields.

In terms of competitive landscape, in the field of DRAM, Samsung, SK Hynix and Micron's three major manufacturers have a total market share of more than 95%in 2023, basically formed an absolute monopoly advantage in this field.The domestic DRAM wafer manufacturer is mainly Hefei Changxin, which is currently in the stage of rapid development.

In terms of technical routes, the industry leader Samsung Electronics took the lead in achieving 20nm process mass production (4GBDDR3 DRAM) in 2014, and introduced technical route competition into the 20nm era. Since then, the DRAM process has achieved breakthroughs every two years. 19 nm) to 1YNM 14 nm-16 nm) to 1znm12-14Nm).In January 2021, Micron Technology took the lead in announcing 1ANM (close to 10 NM DRAM products, and the mainstream original factory began to enter the 1αnm process. At present, the fourth-generation process 1α (1-alpha) of the 10nm level in the industry has gradually become the mainstream in the industry in the industry And being transitioning to 1β (1-Beta).

NAND FLASH mainly includes embedded storage (for electronic mobile terminal low power consumption scenarios), SSD solid -state hard drives (large -capacity storage scenarios), mobile storage (portable storage scenarios), etc.Among them, embedded storage and SSD solid -state drives are the main product categories of NAND Flash, and the market size accounts for more than 85%of the NAND Flash market.In NAND FLASH, the embedded storage market is mainly driven by smartphones and tablets. The downstream market of solid -state hard disks mainly includes server and personal computers. Mobile storage is widely used in various consumer fields.

In terms of competitive pattern, NAND Flash's global market is also highly concentrated.According to data from the CFM flash memory market, the global NAND Flash market rules worldwide were dominated by Samsung Electronics, Armor, SK Hemori, Western Data, and Meiguang Technology. The market share was 30.2%, 20.0%, 18.3%, 15.1. %, 11.1%.Domestic manufacturers have developed rapidly under domestic replacement, and they are catching up with market share and technology.

On the technical route, the main storage factory has continuously improved NAND Flash storage density in fierce competition.Starting from Samsung Electronics in 2013, the 24 -layer 3D NAND that can be commercialized, and the 3D NAND high -end advanced process has entered the 232th stage in 2022. Some manufacturers even start looking forward to the storage form after 1,000 floors in 2023. This will continue Promote the process of storing future development to large capacity development.

In addition to DRAM and NAND Flash, the storage industry also includes Nor Flash, storage main control and other market segments.Among them, NOR FLASH has the characteristics of random storage, fast reading speed, and in -chip execution (XIP). It is cost -effective in small -capacity scenarios. At present Las and Micron, etc.; And the main control chip of the storage can play the role of central control and management scheduling for memory, which is a key factor in storing the rapid commercialization of granules. At present Third -party storage control chip companies such as technology, Miyan Electronics, etc. are led by.