1. Release by the China Semi-AssociationsemiconductorNotice on the "Origin" Determination Rules

According to ChinasemiconductorAccording to the WeChat official account of the Industry Association, the China Semiconductor Industry Association issued an emergency notice on April 11 on the recognition rules for the "original origin" of semiconductor products. The full text is as follows:

Member units:

According to the relevant regulations of the General Administration of Customs, the origin of "integrated circuit" is determined according to the principle of changing the four-digit tax code, that is, the flowing place is recognized as the place of origin. Please be sure to pay attention!

Please prepare PO proof materials when filing for customs verification!

For specific regulations, please carefully study the content of the "Regulations on Substantive Changes to Standards in the Rules of Non-Preferential Origins" Order No. 122 of the General Administration of Customs. If you have any questions, please contact us!

Recommendation: Whether the "integrated circuit" is packaged or not, the origin of the import declaration shall be based on the location of the "wafer die factory".

ChinasemiconductorIndustry Association

April 11, 2025

2. Mind methodsemiconductorStart reshaping, focus on manufacturing business optimization and lay off employees

April 10th local time, Technological and Fasemiconductor(ST) Disclosure will reshape the manufacturing layout and ensure the long-term sustainability of ST as an IDM by adjusting the manufacturing layout and optimizing the cost structure.

In terms of manufacturing,STFocus on investing in 300mm silicon wafers and 200mm silicon carbide wafer factories to achieve large-scale production and will improve the production efficiency of mature technologies of 150mm and 200mm. Introduce more AI and automation technologies in technology research and development, manufacturing, reliability and certification processes to improve efficiency and focus on sustainability.

France's 300mm fab will be the core of digital products, with production capacity increasing to 14,000 wafers per week by 2027. Agrate’s 300mm fab in Italy will become the flagship manufacturing facility for smart power and mixed signal technology, with production capacity increasing to 4,000 wafers per week by 2027.SingaporeFabs focus on high-yield manufacturing of mature technologies and integrate global 150mm silicon wafer capabilities.

Factory in France, Rousset, Tours and Kirkop, Malta will optimize production capacity and functions according to market demand. Catania, Italy, will continue to be power and broadband gapsemiconductorCenter of Excellence for Devices, the development of the new SiC Park is underway as planned, with 200mm wafer production to begin in the fourth quarter of 2025, and resources for 150mm and EWS capabilities will be re-concentrated on 200mm SiC and SiliconPower semiconductorsIn terms of production, GaN-on-silicon is included.

As advanced manufacturing advances, employee roles will shift from traditional manual tasks to process control, automation and design.STThe voluntary resignation program will be adopted, and up to 2,800 employees are expected to voluntarily leave by 2027 to optimize the global cost structure.

3.SEMI: Global in 2024semiconductorEquipment shipments soar to $117 billion

internationalitysemiconductorThe Industry Association (SEMI) recently released a report stating that the global shipment of semiconductor manufacturing equipment reached US$117.1 billion in 2024, an increase of 10% from US$106.3 billion in 2023. From a regional perspective, mainland China, South Korea and Taiwan are still the top three markets in semiconductor equipment spending, accounting for a total of 74% of the global market.

2024, the global frontsemiconductorThe equipment market achieved significant growth, with sales of wafer processing equipment up 9% and sales in other front-end segments up 5%. This growth is mainly due to increased investment in advanced logic, mature logic, advanced packaging and HBM capacity expansion, as well as a significant increase in investment in China.

After two consecutive years of declines, the back-end device segment recovered strongly in 2024, mainly due toAIand HBM manufacturing is increasingly complex. Packaging and test equipment sales increased by 25% and 20%, respectively, reflecting the industry's efforts to support advanced technologies.

4. TransmissionTSMCConstruction of Kumamoto II Factory was postponed, and resources were tilted towards new US factories

According to IT Home quoting Taiwan's "Economic Daily" news,TSMCAs the construction of new US factories is accelerated, sources pointed out that the progress of Kumamoto's second wafer fab of TSMC's Japanese subsidiary JASM will be delayed.

It is reported that,TSMCThe construction of Kumamoto's second wafer factory of Japanese subsidiary JASM was originally scheduled to start in the first quarter of this year, but sources pointed out that the corresponding project will be postponed to "within this year". Although the corresponding construction project is postponed, this does not mean that TSMC's Japanese subsidiary JASM will give up the construction of this new wafer factory.

industryAnalysis: Influenced by the US authorities' policies, the main production of Japanese factories is also consideredcar industrychipThe product has low terminal demand, andTSMCA lot of supplycarBrand customers have also shown a willingness to expand investment and production in the United States recently, so this may allow TSMC to prioritize resources on new U.S. factories.