The first quarter wafer foundry ranking was released.TSMCStable in the leader

According to Kuai Technology, according to the latest survey by TrendForce, the global wafer foundry industry revenue in the first quarter of 2025 was approximately US$36.4 billion, a month-on-month decrease of about 5.4%.Despite facing off-season pressure, changes in the international situation have prompted some customers to prepare stocks in advance and release urgent orders. In addition, China's continued "old-for-new" subsidy policy has effectively stimulated demand and cushioned the overall decline.

In terms of manufacturers,TSMCWith revenue of US$25.5 billion and market share of 67.6%, a 5% decline from the previous month.SamsungRevenue fell 11.3% month-on-month to US$2.89 billion, and its market share dropped slightly to 7.7%.SMICIt grew by 1.8% against the trend, with revenue reaching US$2.25 billion, ranking third.The fourth to tenth places are UMC, GM, Huahong Group, World Advanced, and Towersemiconductor, Hefei Jinghe, Liji Electric.

MicronLaunch the first 1γ process LPDDR5X memory to enhance flagshipcell phoneAI experience

Micron(Micron) launched the world's first 1γ (1-Gamma, 6th generation 10nm level) process LPDDR5X memory on the 3rd local time, aiming to accelerate flagship intelligencecell phoneAI applications on.This product offers 10.7 Gbps per secondindustryThe fastest LPDDR5X speed rating, coupled with up to 20% energy savings, brings faster, smoother mobile experiences and longer mobile phones even when performing data-intensive workloads such as AI-powered translation or image generation.Batterylife.

To satisfyindustryFor the next generation of intelligencecell phoneThe growing demand for designing compact solutions,MicronEngineers have reduced the LPDDR5X package size and providedindustryThe thinnest 0.61mm package makes it 6% thinner than competing products and is 14% lower in height compared to the previous generation.As AI demand for powerful and energy-saving computing intensifies, data center servers and smartcarAnd AI PCs may also increasingly adopt LPDDR5X.

MicronSelected partners are currently being sampled for 1γ-based LPDDR5X 16GB products and will be available in a variety of capacity from 8GB to 32GB for flagship smarts in 2026cell phone.

BroadcomLaunching Tomahawk 6 switchchip, refresh the maximum switching capacity

Broadcom(Broadcom) announced the launch of the Tomahawk 6 switch series on June 3 local time,chipThe world's first 102.4 megabit/second switching capacity is twice the bandwidth of any Ethernet switch on the market.

With unprecedented scale, energy efficiency andAIOptimized features, Tomahawk 6 is designed to power the next generation of scalable and scalable AI networks, providing unparalleled flexibility by supporting 100G/200G SerDes and co-package optics (CPO).It providesindustryThe most comprehensive AI routing capabilities and interconnection options are designed to meet the needs of AI clusters with over 1 million XPUs.

ADIJoining multiple companies to establish OpenGMSL alliance to promote the worldcarOpen ecology

Original analog device factoryADIRecently announced, with many leading companiescarOriginal Equipment Manufacturer (OEM), Tier 1 Supplier,semiconductorManufacturers and ecosystem partners jointly announce the establishment of the OpenGMSL alliance to build SerDes transmission of video and/or high-speed data into the worldcarOpen standards for ecosystems.

Alliance includesADIMore than 20 companies including Aptiv PLC, Coilcraft, etc.carIndustrial chain enterprises.OpenGMSL standard is based onADIThe company's Gigabit Multimedia Serial Link (GMSL) technology, the application and innovation of this standard will reshape the development of autonomous driving, advanced driving assistance systems (ADAS) and infotainment systems.