Cadence (Cadence, NASDAQ: CDNS) today announced the launch of Cadence Celsius Studio to provide the first AI cooling design and analysis solution for electronic systems in the industry.CELSIUS Studio can be used for electronic heat dissipation design of PCB and complete electronic components, and can also be used for thermal and thermal analysis of 2.5D and 3D-IC packaging.The current products on the current market are mainly composed of different scattered tools, and CELSIUS Studio introduces a new method. Through a unified platform, electrical and machinery/thermal engineers can design, analyze and optimize product performance at the same time. There is no need to simplify geometric simplification , Operation and/or conversion.

Celsius Studio brings a new system -level thermal integrity solution to combine electrical heating synergy simulation, electronic heat dissipation and thermal stress analysis.Cadence acquired Future Facilities in 2022. Electrical and mechanical engineers can now use first -class electronic cooling technology.In addition, Celsius Studio can be seamlessly used to design synchronous physical field analysis, help designers find the problem of heat integrity in the early stage of the design process, and effectively use the generated AI optimization algorithm and novel modeling algorithm to determine the ideal heat dissipation design.

In the end, designers can simplify the workflow, improve teamwork, reduce design iterative, realize predictable design progress, and then shorten the weekly transfer time and speed up the listing of product.Celsius Studio has the following advantages:

· ECAD/MCAD Unified: Design file seamless integration, no need to simplify, the workflow is smoother, and achieve fast and efficient design synchronization analysis.

· AI design optimization: Celsius Studio is equipped with Cadence Optimality Intelligeent System Explorer AI technology, which can explore the entire design space and lock the ideal design.

· Synchronous analysis of the design of 2.5D and 3D-IC packaging: It has unprecedented strong performance, and easily analyzes any 2.5D and 3D-IC packaging without any simplification, and the accuracy will not be discounted.

· Micro and macro modeling: Small to the chip and its power distribution network, which is as large as the chassis structure used to place PCB, can be accurately modeling, which is innovative in the market.

· Large -scale simulation: precise simulation large systems, perfectly restore the details of the structure of chips, packaging, PCB, fan or case.

· Multi-phase analysis: Help the designer's analysis of the design and assembly process, solve the problem of 3D-IC with a multi-grain stacked 3D-IC warranty on a single package.

· Real system -level thermal analysis: Combined with the FEM and Calculating Dippermal Duration (CFD) to perform a full system -level thermal analysis from chip to packaging to the circuit board and terminal system.

· Seamless integration: Realize platform integration with Cadence, including Virtuoso Layout Suite, Allegro X Design Platform, Innovus Implementation System, Optimality Intelligent Syplorer, and AWR design Environment.

"The advent of CELSIUS Studio is a milestone of the Cadence Pioneering System Analysis Market. It not only provides the ideal AI platform for chips, packaging and PCB thermal analysis, but also provides an excellent AI platform for electronic heat dissipation and thermal stress analysis. For today's advanced advanced, the advanced advanced today For packaging design (including Chice and 3D-IC), this type of analysis is crucial.Ben Gu, the global vice president and general manager of the simulation division of the multi -physical field, said, "Celsius Studio and Cadence's powerful implementation platform seamlessly integrated, enabling our customers to perform multi -physical fields on chips, packaging and circuit boards and even complete systems. Design synchronous analysis."

client feedback

"Celsius Studio helps Samsung semiconductor engineers to obtain analysis and design insights in the early stages of the design cycle, and quickly generate precise simulation of 3D-IC and 2.5D packaging in a simpler way. Through the cooperation with Cadence, our product development efficiency has improved. 30%, at the same time optimized the packaging design process and shortened the turnover time. "

-Woopoung kim, head of advanced packaging,

SAMSUNG Device Solutions Research American

"CELSIUS STUDIO is seamlessly integrated through BAE Systems custom GAN PDK and Cadence AWR Microwave Office IC design platform. It can conduct fast and accurate heat analysis throughout the MMIC design cycle, increase the probability of designing one -time success, and significantly improved a significant improvement The performance of RF and thermal power amplifier. "

-Michael LITCHFIFID, Technical Director, Mmic Design at Bae Systems

"With the help of Celsius Studio, our design team can master details and work in the early stage of the design cycle, so that we can timely discover and solve the heat dissipation problem in time before the design is fully put into production. As the turnover time is significantly shortened, these complex development is developing. During the design process, the Chicletz engineering team can run efficient and detailed heat simulation for 3D-IC and 2.5D packaging as soon as possible. "

-Jeff cain, VP of Engineering, Chipletz

Available

Learn more information about CELSIUS Studio, please visitwww.cadence.com/go/cstudioprEssenceIf you are interested in customers who participate in the early use of Celsius Studio, please contact Cadence customer representatives to learn more.