XCZU4EG-3FBVB900E
Part Number:
XCZU4EG-3FBVB900E
Manufacturer:
Xilinx
Description:
IC FPGA 204 I/O 900FCBGA
Lead Free Status:
Lead free / RoHS Compliant
Stock Quantity:
24978 Pieces
Delivery Time:
1-2 days
Lead time:
4-8 weeks
Data sheet:
1.XCZU4EG-3FBVB900E.pdf2.XCZU4EG-3FBVB900E.pdf3.XCZU4EG-3FBVB900E.pdf4.XCZU4EG-3FBVB900E.pdf

Introduction

XCZU4EG-3FBVB900E is available now! LYNTEAM Technology is the stocking distributor for XCZU4EG-3FBVB900E, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for XCZU4EG-3FBVB900E by email, we will give you a best price according your plan.
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Specifications

Condition New & Original, tested
Country of origin Contact us
Marking Code Send by email
Supplier Device Package:900-FCBGA (31x31)
Speed:600MHz, 1.5GHz
Series:Zynq® UltraScale+™ MPSoC EG
RAM Size:256KB
Primary Attributes:Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
Peripherals:DMA, WDT
Packaging:Tray
Package / Case:900-BBGA, FCBGA
Operating Temperature:0°C ~ 100°C (TJ)
Number of I/O:204
Moisture Sensitivity Level (MSL):4 (72 Hours)
Manufacturer Standard Lead Time:10 Weeks
Lead Free Status / RoHS Status:Lead free / RoHS Compliant
Flash Size:-
Detailed Description:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 192K+ Logic Cells 256KB 600MHz, 1.5GHz 900-FCBGA (31x31)
Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Connectivity:CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture:MCU, FPGA
Email:[email protected]

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