RC3225F2554CS is available now! LYNTEAM Technology is the stocking distributor for RC3225F2554CS, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for RC3225F2554CS by email, we will give you a best price according your plan.
Buy RC3225F2554CS with LYNTEAM, save your money and time.
Our email: [email protected]
RC3225F2554CS
- Part Number:
- RC3225F2554CS
- Manufacturer:
- Samsung Electro-Mechanics America, Inc.
- Description:
- RES 2.55M OHM 1% 1/3W 1210
- Lead Free Status:
- Lead free / RoHS Compliant
- Stock Quantity:
- 56267 Pieces
- Delivery Time:
- 1-2 days
- Lead time:
- 4-8 weeks
- Data sheet:
- 1.RC3225F2554CS.pdf2.RC3225F2554CS.pdf
Introduction
Specifications
| Condition | New & Original, tested |
|---|---|
| Country of origin | Contact us |
| Marking Code | Send by email |
| Tolerance: | ±1% |
| Temperature Coefficient: | ±100ppm/°C |
| Supplier Device Package: | 1210 |
| Size / Dimension: | 0.126" L x 0.100" W (3.20mm x 2.55mm) |
| Series: | RC |
| Resistance: | 2.55 MOhms |
| Power (Watts): | 0.333W, 1/3W |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 1210 (3225 Metric) |
| Operating Temperature: | -55°C ~ 155°C |
| Number of Terminations: | 2 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Height - Seated (Max): | 0.026" (0.66mm) |
| Features: | Moisture Resistant |
| Failure Rate: | - |
| Detailed Description: | 2.55 MOhms ±1% 0.333W, 1/3W Chip Resistor 1210 (3225 Metric) Moisture Resistant Thick Film |
| Composition: | Thick Film |
| Email: | [email protected] |
Related parts for RC3225F2554CS
Latest News
- Overview of the MCU process change bureau: the development path of AI application and cost reduction tide
- ST cooperates with Hua Hong Semiconductor to produce 40 nanote MCU
- Silicon wafer shipments continued to grow in the third quarter, and Risa pushed the new 3 -nanometer SOC
- The performance of the two major MCUs was announced, and TSMC's advanced packaging and spreading price increase
- Decomposition smart door lock: MDD diode technology extraordinary application
- ST lowered the annual expectations, Siruipu dissolved MCU team
- ARM comprehensive design helps ARM architecture ecological development, and build sustainable AI data centers
- TSMC's revenue increased by nearly 40 % year -on -year. Intel and AMD jointly promoted the X86 ecology
- Capacitor: Electronic World Energy Guardian
- Nobel Prize in the field of AI, welcoming ICs in the peak season
- Unveiled the resistor
- Vishay official announcement factory reorganization, Micron NAND flash memory revenue innovated high