MID200-12A4 is available now! LYNTEAM Technology is the stocking distributor for MID200-12A4, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for MID200-12A4 by email, we will give you a best price according your plan.
Buy MID200-12A4 with LYNTEAM, save your money and time.
Our email: [email protected]
MID200-12A4
- Part Number:
- MID200-12A4
- Manufacturer:
- IXYS Corporation
- Description:
- MOD IGBT RBSOA 1200V 270A Y3-DCB
- Lead Free Status:
- Lead free / RoHS Compliant
- Stock Quantity:
- 55217 Pieces
- Delivery Time:
- 1-2 days
- Lead time:
- 4-8 weeks
- Data sheet:
- MID200-12A4.pdf
Introduction
Specifications
| Condition | New & Original, tested |
|---|---|
| Country of origin | Contact us |
| Marking Code | Send by email |
| Voltage - Collector Emitter Breakdown (Max): | 1200V |
| Vce(on) (Max) @ Vge, Ic: | 2.7V @ 15V, 150A |
| Supplier Device Package: | Y3-DCB |
| Series: | - |
| Power - Max: | 1130W |
| Package / Case: | Y3-DCB |
| Operating Temperature: | 150°C (TJ) |
| NTC Thermistor: | No |
| Mounting Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 32 Weeks |
| Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
| Input Capacitance (Cies) @ Vce: | 11nF @ 25V |
| Input: | Standard |
| IGBT Type: | NPT |
| Detailed Description: | IGBT Module NPT Single 1200V 270A 1130W Chassis Mount Y3-DCB |
| Current - Collector Cutoff (Max): | 10mA |
| Current - Collector (Ic) (Max): | 270A |
| Configuration: | Single |
| Base Part Number: | MID |
| Email: | [email protected] |
Related parts for MID200-12A4
Latest News
- Ansonmei launched an inductive position sensor for the industrial and transportation market
- Ruisa starts the old factory to increase the power device, the earthquake affects DRAM output mild
- Microchip enables the production capacity of TSMC and increases price increases
- Ruisa launched the new RA0 series ultra -low power entry -level MCU
- Melexis launches a full -integrated inductor switch chip
- X-FAB introduces image sensor back illumination technology to enhance CMOS sensor performance
- The large chip factory was affected by the earthquake: TSMC stopped working urgently, exacerbating the GPU supply in short supply?
- NAND flash memory continues, MCU destocking bottom is right
- Under the AI air outlet, the two major chip giants are "not strong": smashing the money to break the game, bet on 2025 team battles
- Toshiba launches SmartMCD series gate driver IC with embedded microcontroller
- Samsung: Face the challenge of the two major areas, raise funds to break the situation
- The mature margin foundry reduces the price again, Samsung is independent of Nvidia HBM3E memory