1. 1.TSMCAcquisition group fabric factories, expand advanced packaging

According to the relevant reports of fast technology, recentlyTSMCSuccessfully reached a transaction with Qunchuang Optoelectronics, and officially acquired a large factory and its supporting facilities in the latter in the southern Science and Technology Park of China. This measure undoubtedly injected a strong driving force for TSMC accelerated the expansion of advanced packaging capacity.The newly purchased plant covers an area of ​​more than 96,000 square meters, and the transaction amount is finally locked at NT $ 17.14 billion.

People in the industry generally believe that this transaction is a win -win cooperation.For Qunchuang Optoelectronics, it has successfully achieved the realization of idle assets, and has made more room for the company's future development.rightTSMCIn terms of, it quickly obtained the urgently needed factory resources, which greatly shortened the time cycle of production capacity expansion, effectively alleviating the stress of production capacity caused by the surge in market demand.

2. Texas Instruments received $ 1.6 billionchipSubsidy, for 300 mm capacity investment construction

Texas Instruments (TI) recently announced that it will get the United StateschipThe $ 1.6 billion funded and US $ 3. billion loan provided by the bill is used for three 300 mm wafer fabs in Texas and Utah.

according tochipThe direct funds proposed by the bill will support TI to invest more than 18 billion US dollars by 2029 to support three new wafer fabs, two of which are located in Sm1 and SM2, Texas, and one is located in Utah. LFAB2 (LFAB2), these wafers will produce 28nm to 130nm technology nodessemiconductorProvide the best cost, performance, power consumption, accuracy and voltage level for TI's extensive simulation and embedded processing product portfolios.

3. The first 180 million pixel full -frame CIS successfully tried production in Jinghe Integrated Industry

Jinghe Integration announced that it jointly launched the industry's first 180 million pixel full -frame (2.77 inches) CIS with the domestic advanced design company Stewell.This product has 180 million ultra -high pixel 8K 30FPS Pixgain HDR model high -frame rate and ultra -high dynamic range and other leading performances. It innovates optimized optical structure. It can be compatible with different optical lenses. Sony Sony has long -term monopoly position in the field of ultra -high pixel full -frame CIS, contributing to the development of local industries.

Jinghe integrates the 55 -nanometer technology platform based on independent research and development, and cooperates with Stewell to develop light -engraved splicing technology, overcoming difficulties such as stitching accuracy and improvement in pixel columns.chipIn terms of size, the limits of a conventional light hood can be covered. At the same time, in the nano -level manufacturing process, the splicing chip still guarantees the coherent consistency of electrical performance and optical performance.

4. SoftBank AIchipCancel cooperation with Ingel's foundry and turn headTSMC

According to fast technology,IntelIt didn't take long before the foundry business started, and it suffered a major loss. SoftBank broke the cooperation with Intel.chipOEM transferred toTSMCEssence

IntelOEM provides two processes: Intel 3 and Intel 20A, of which the latter is the absolute main force, and it is also an anti -overtakingTSMCThe key point of seizing the first technique of advanced craftsmanship, the two new technologies of power supply behind Powervia and the full surround transistor of the RibbonFet, indeed won a lot of orders, including SoftBank.

In February this year, some reports were reported to invest 100 billion U.S. dollars to create a new AI company Project Izanagi, which intended to competeNivineAnd and andIntelReached cooperation.But now, SoftBank has turned toTSMCThe reason is that Intel cannot meet its needs for "production capacity and performance".At present, all parties have not commented on this incident.

5. Institution: It is expected that NAND IC sales will double this year

According to the Science and Technology Board Daily, Techinsights predicts the data center of AI data centersstorageThe demand for solutions will increase.In the second quarter of 2024, the demand for high -capacity and high -performance NAND content increased, which promoted the development of the data center SSD market.During the remaining time this year, although some consumer fields have recovered slowly, it is expected that NAND IC sales will achieve a year -on -year growth of 99%in 2024, and in 2025, it will increase the year -on -year growth.

6. Research: GAN power component market has expanded rapidly, AI server applications are broad

According to IT home news, TrendForce's latest report shows that withBritish Fei Ling , Texas Instruments, etc., have devoted more resources to GAN (nitrogen) technology, and the development of the power GAN industry will be accelerated again.In 2023, the global GAN ​​power component market size was about $ 271 million, and by 2030, it was expected to rise to $ 4.376 billion, with an average annual growth rate of 49%.

Consumer electronics is the main battlefield of the power GAN industry, and it is quickly extended from a fast charger to home appliances and intelligence.cell phoneIn other areas, the next step will enter the laptop and home appliances with stricter reliability requirements.The proportion of AI servers in 2024 is expected to reach 12.2%, an increase of about 3.4%from 2023, while the shipments of general servers increased by only 1.9%year -on -year.In order to cope with higher -end AI computing, the energy efficiency and power density of server power must be further improved, and GAN has become one of the key solutions.