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TSMC 2 nanometer is more than 60%, and mass production next year

  • Source:Network finishing
  • Release on:2024-12-17

1. 1.TSMC2 nanometer rate is more than 60%, and large -scale mass production next year

According to fast technology, foreign media news,TSMCIt is planned to start mass production of 2 nanometers next yearchipAt present, it has been tried in a factory in Hsinchu, and the results show that its yield has reached more than 60%.There is still much room for improvement in this data. Generally, the corresponding chip yield requires 70%or higher to enter the large -scale mass production stage.

At the current 60%test yield,TSMCOnly next year can enable the 2 -nanometer to enter the large -scale production stage, but this progress has been far ahead of all competitors in the world.at presentNivineAs well asAMDThey are all 2mm customers, but the first to be used is stillappleNow that the product is planned, the A20 of Apple iPhone 18chipIt is used for the first time and is paired with SOIC advanced packaging.

2. NXP and the world advancedSingaporeCooperative wafer factory officially started construction

The World of NXP and wafer agencies announced that the 300mm wafer manufacturing plant of the joint venture company VSMC of the two parties held a ritual opening ceremony.It is expected that the plant will start production in 2027. After the first stage of successful launch, it will be considered and developed in accordance with the future business development of the two major partners.It is expected that by 2029, the wafer plant will produce 55,000 300 mm wafers per month.

The wafer plant will adopt a fully automated production model to integrate the self -animal materials handling system and passAIComprehensive quality management of applications.This will achieve excellent manufacturing of fast, accurate, high output, and high -quality manufacturing, provide customers with competitive services, andSingaporeCreate a smart wafer plant.

3. In the third quarter, the top ten wafer foundries revenue revenue record high,SMICThird

According to fast technology news, according to the latest report from market research institution TrendForce, the total revenue of the top ten wafer ages in the world in the third quarter of 2024 increased by 9.1%, reaching 34.9 billion US dollars, a record high.

Growth is mainly due to new intelligencecell phoneThe release of PC/notebooks drives supply chain stocking, and the continued strong demand for AI server -related high -performance calculations (HPC).In the third quarter, the growth part is due to the significant contribution of the high price of 3nm. Looking forward to the fourth quarter, the advanced process will continue to drive the revenue of the wafer factories.

TSMCStay a leading position with nearly 65%of its share,SamsungMaintain the status of the second largest wafer foundation factory, and the market share has dropped to 9.3%.SMICStable in the third and fourth and fifth respectively, UMC and Georfang are ranked fourth and fifth respectively. The capacity utilization rate of Huihong Group, TOWER, World Advanced and Liji Power Power has also increased. The surrounding component is urgent.

4. Qunchuang: FOPLP advanced packaging production time delay

According to the Science and Technology Board Daily, Hong Jinyang, chairman of Qunchuang Optoelectronics, said that the company's FOPLP (fan -out panel -level packaging) advanced packaging production time is delayed at the end of this year.

Hong Jinyang said that this delay was affected by the two aspects of the internal and external parts: First, the new technology learning curve is long; second, because of the intelligence, due to intelligence, due to intelligencecell phonePoor market conditions have adjusted the original mobile PMIC packaging order.Qunchuang is also developing other applications of FOPLP, and the production time may be postponed until the first half of next year.He also emphasized that it is still optimistic about the future development of FOPLP's advanced packaging.

5.semiconductorWill supply silicon carbide devices to AMPERE of Renault

December 3, Italian FasemiconductorSigning an agreement with Renault Group will start from 2026 to the latter's pure smart electriccarManufacturing enterprise AMPERE supply silicon carbide (SIC) power module.The agreement is part of the Renault Group and the Sympathetic Semiconductor, which is part of the cooperation plan for the development of the power control system for the Anti ultra -efficient electric vehicle inverter.

DeedsemiconductorCooperate with Ampere to develop a power box to power the latter's new -generation motor.The power box is 400 volts in the Ampere seriesBatteryelectriccarIt is designed with the best performance size of the 800 -volt battery C -section C -section, which can achieve greater autonomy and faster charging.

6.BroadcomLaunched 3.5D F2F packaging technology,Fujitsu2 nanometerchipuse

BroadcomA few days ago, the industry's first 3.5D XDSIP packaging platform with 3.5D F2F packaging technology. The platform integrates more than 6,000 square millimeters of silicon and up to 12 HBM stacks in a packaging equipment, which can achieve high -efficiency and low power consumption on a large scaleAIcalculate.

BroadcomThe latest 3.5D platformFujitsu The next-generation processor FUJITSU-Monaka based on 2 nanometer ARM can achieve high performance, low power and low cost.With the development of more than five 3.5D products, most consumers of BroadcomAICustomers have adopted the 3.5D XDSIP platform technology, which has been produced in February 2026.

7. Shengbang Wei launched a new digital model converter SGM71622R8

Shengbang Micro Electronics recently announced that the launch of the SGM71622R8 serieschipA digital model converter (DAC) with an internal reference voltage output with an 8 -channel, 16 -bit, SPI interface, and internal base voltage output.This device can be applied to optical modules, programmable logic controllers, industrial automation and laboratory instruments.

Under 5.5V power supply conditions, the power consumption of each channel is only 0.5mA, which is very suitableBatteryPower supply portable equipment.In the power -saving mode, the power consumption is further reduced to 0.5 μA/channel, which significantly extend the service life of the equipment.

The SGM71622R8 series adopts TQFN-3.5 × 3.5-16AL, TQFN-3-16DL and WLCSP-2.45-16B green packaging with the concept of environmental protection concept. The working temperature range is -40 ° C to+125 ° C. environment.