1.SamsungIntroducing the Yangtze Riverstoragepatent, solve the problem of flash stacking

According to Kuai Technology, citing Korean media reports,SamsungRecently, with the Yangtze RiverstorageSigned 3D NAND hybrid bondingpatentThe license agreement, starting with the 10th generation V-NAND (V10), will use Yangtze Memory’s patented technology, especially in terms of “hybrid bonding” technology.

SamsungThe next generation V10 NAND is planned to mass-produce in the second half of 2025. The number of stacked layers is expected to reach 420 to 430 layers. When the number of layers exceeds 400 layers, the pressure on the underlying peripheral circuit will increase significantly, affecting the impact ofchipreliability.

To solve this problem,SamsungIt was decided to introduce W2W hybrid bonding technology in V10 NAND, which shortens the electrical path, improves performance and heat dissipation capabilities, and optimizes production efficiency by directly bonding two wafers without traditional bump connections.Four years ago, the Yangtze RiverstorageIt was the first to apply hybrid bonding technology to 3D NAND manufacturing and named it "Xtacking" and at the same time, it established a completepatentlayout.

2. Fudan Microelectronics: Overseas in the near futureFPGASome products of manufacturers have increased their prices

According to Cailianshe, Fudan Microelectronics said during an institution that (recently) overseas represented by XilinxFPGASome of the manufacturers' products have price increases.It is understood that the prices of domestic FPGA manufacturers are generally stable at present, and the company mainly uses high-reliability fields, which is relatively weak in correlation with price changes of overseas manufacturers.

At present, a new generation based on 1xnmFinFET advanced processFPGAProduct, intelligent reconfigurablechipThe sample test of the product has been completed, and small batch sales have been made for some imported customers, and yield improvement work has been carried out simultaneously. Product genealogy is also being promoted.Future sales should comprehensively consider factors such as customer application conditions and production capacity conditions.

3. Statistics: Taiwan, China, the wafer foundry output value will increase by 30% in 2024

According to IT Home, according to Taiwan, ChinasemiconductorAccording to data released by the association on the 17th, the overall output value of the IC industry in Taiwan in 2024 reached NT$531.51 billion (currently approximately RMB 1.18 trillion), an increase of 22.4% over 2023.

Among the increments corresponding to the 22.4% increase, 3/4 are from wafer foundry: they have the leading leading advanced process foundryTSMCTaiwan, China, achieved revenue of NT$324.38 billion in the sub-industry last year, a year-on-year increase of 30.1%; the proportion of wafer foundry revenue in the overall market also increased from 57.39% in 2023 to 61.03%.

4. TransmissionAMDNegotiate the sale of server factory, valued at $4 billion

According to Cailianshe, people familiar with the matter said thatAMDNegotiations are in place with an Asian company on the sale of the data center manufacturing plant it agreed to acquire last year.

Companies such as Renbao, Inertia, Pegatron and Wistron have expressed their intention to acquire, and the valuation of these assets, including debt, may be between $3 billion and $4 billion, people familiar with the matter said.People familiar with the matter who declined to be named because of discussions on confidential information said the sale could be announced as early as the second quarter.They said the consultations were still ongoing and uncertainAMDWhether an agreement will be reached.

5. CountryChip TechnologyTechnology: Automotive-grade information securitychipMassive supply of over one million pieces

According to Cailianshe,Chip TechnologyAccording to the interactive platform, the company's products have not yet been adapted to DEEP SEEK related.In the practical application of intelligent driving and cockpit, the company's automotive-grade information securitychip, domain control MCU chips, noise reduction and advanced sound processing DSP chips have good application prospects.

Currently the company's automotive-grade information securitychip CCM4202S has shown good technical advantages and high cost performance, and has achieved mass supply of more than one million units in smart cockpit applications.