1. Drmos device is overheated and affectsNivineThe next generation of AI system mass production
According to fast technology news, according to analyst Guo Mingzheng's latest investment research report,NivineIt is developing DRMOS technology for its next -generation AI server GB300 and B300, but in the process, it encountered the problem of overheating components.Specifically, 5x5 drmos provided by AOSchipThere is a severe overheating problem, which may affect the production progress of the system and change the market's expectations for AOS orders.
Guo Mingzheng pointed out,NivinePriority testing AOS's 5X5 DRMOS aims to enhance the bargaining ability to MPS and reduce costs. At the same time, it also has rich experience in the design and production of 5X5 DRMOS.The supply chain message shows that AOS's 5X5 DRMOS overheating problem does not only originate fromchipIt also involves insufficient design in other aspects such as system chip management.
If AOS cannot solve this problem within the specified time limit,NivineThe new 5x5 DRMOS supplier may be considered or the 5x6 DRMOS is used.The latter costs higher, but it has better cooling efficiency, which is conducive to MPS companies.In serious cases, this problem may cause mass production extension of the GB300/B300 system.
2.NivineGB200 cabinet is expected to be as fast as the second quarter of next year
According to the Science and Technology Board Daily, TrendForce Ji State Consultation Yu's latest survey pointed out that the recent market attentionNivineThe supply progress of the GB200 entire cabinet scheme (RACK), because the design specifications such as GB200 RACK in high -speed interdependence interface, thermal design power consumption (TDP) are significantly higher than the mainstream market. It is expected that the opportunity will only be available after the second quarter of 2025.
3. UMCHighlightchipPackage, break, breakTSMCExclusive
According to the relevant reports of fast technology, UMC wonHighlightThe advanced packaging of high -performance computing products is expected to be applied to the AI PC, car and AI server market, and even the integration of HBM.At the same time, this also breaks the advanced packaging foundry marketTSMCAs well asIntelAs well asSamsungWaiting for a few manufacturers to monopoly.
At present, UMC mainly supplies intermediary layers in the field of advanced packaging, which is applied to the RFSOI process, which has limited contributions to revenue, butHighlightThis order has opened new business opportunities for UMC.People familiar with the matter revealed that Qualcomm plans to commission the customized Overon architectureTSMCMass production and entrust UNEC for advanced packaging, and it is expected to adopt the WOW Hybrid Bonding process of UMC.
Analysis believes,HighlightAdopting UMC's advanced packaging technology will combine POP packaging replace the traditional tin ball welding packaging mode, shorteningchipInter -signal transmission distance, improve the efficiency of chip computing.The UMC has the equipment and TSV process technology of the production intermediary layer, which meets the prerequisites of advanced packaging process mass production. This is also the main reason for Qualcomm to choose UMC.
4. NXP acquisitioncarNetwork Technology Supplier Aviva Links
NXP (NXP) announced that Aviva Links, a $ 242.5 million full -cash transaction, is in line withcarSerdes Alliance (ASA) standard car connection solution provider.AviVa Links providesindustryThe most advanced product portfolio that meets ASA standards, supports the Serdes dot pair (ASA-ML) and the Ethernet-based connection (ASA-MLE), the data rate is as high as 16 GBPS.The company has won design victory in two major car OEMs and is providing samples to various OEMs and first -level suppliers.
carThe Serdes Alliance (ASA) was established in 2019. NXP is the founding member to help participating in the car manufacturer's migration to open source and interoperable network solutions to meet the growing software definition of automotive products in software. EssenceASA provides an open standard, which can be expanded from 2 GBPS to 16 Gbps, including link layer security.In addition to the establishment of the SERDES point -to -point communication, this standard also solves the high efficiency EthernetsensorSeamless migration of connection.
5.AnsonamiStrengthen cooperation with electricity in the field of autonomous driving
Ansonami(OnSemi) announced a few days ago, andcarT1 supplier's power installation has strengthened cooperative relationships in the technology of autonomous driving and advanced driving assistance systems (ADAS).For more than 10 years, Ansonmi has always provided the latest smart cars for electricity installationssensor, To improve ADAS and autonomous driving performance.ThesesemiconductorIt is becoming increasingly important in improving the intelligence of vehicles, including networking, which will help reduce traffic casualties.
As a sign of the cooperation between the two parties, the electricity plan is acquired on the open marketAnsonamiStocks to further consolidate long -term cooperative relationships.